• We also introduced a natural glue-remover to clean glue residue left on advertisement billboards.
• In the same year, EverDependUp Co., Ltd. invented alkali-proof dyes (tolerant of pH 14, NaOH >10%, including red, yellow and blue) and alkali-proof surfactant (including anion high-foam, low-foam, and non-foam kind) successfully. Also, we began the research and development of sanitation and kitchen-hygiene products.

• In the same year, EverDependUp became the softener supplier of the largest feather company in Taiwan.

• Meanwhile, EverDependUp has become the only supplier of Solid dishwasher detergent for the best brand of kitchen machine in Japan.

• In the same year, the epidemic of SARS influenced Taiwan people seriously. EverDependUp cooperated with “Chinese Petroleum Corp”, the largest company in Taiwan, to provide the people with the high quality product Quality EngramTM hand-cleaner. With the sale price almost equally the production cost, EverDependUp's goal was to serve our society. This product was the only hand-cleaner made with “Fatty Amino Acid Surfactant” in the market. This product provided our customers with uniquely fresh feelings and is gentle to the skin. This product gained EverDependUp a huge amount of consumer confidence in the Taiwan market.

• In the same year, EverDependUp invented another series of products made by “Fatty Amino Acid Surfactant”, such as shower gel, shampoo, dish cleaner, hand-cleaner dew.

• Also in 2004, EverDependUp began the research and development of PowerWash™ condenser/radiator cleaner. This product is used to clean the condenser/radiator to improve air conditioner/engine efficiency. We applied for a patent officially from the national intellectual property office.
• Our developed shampoo has been introduced to hair salon businesses.
 

• Power Wash condenser/radiator cleaner has been announced officially in Patent Application Publication Gazette, Republic of China on Aug 1, 2005.
• Began exporting the Quality EngramTM herbal shampoo to Germany after 2 years of research and development under the strict guidelines of our German customers.

• Our natural glue-remover is adopted by TSMC (Taiwan Semiconductor Manufacturing Company) and applied on glue-remove and cleaning of Pellicle Film. It's sold by Micro Lithography, INC.
• EverDependUp has become Sinon Corporation’s OEM manufacturer. Sinon Corporation is the Largest agriculture company in Taiwan, we produced FonCon dish cleaner, FonCon vegetable cleaner, and so on.

• In March, General Motors Co. in Taichung began selling PowerWash condenser/radiator cleaner. The consumers have shown their great satisfaction so far.
• In July, Every original agent company of NISSAN Taiwan began selling PowerWash condenser/radiator cleaner. Nissan has found great success using our Power Wash condenser/radiator cleaner.
• In October, PowerWash condenser/radiator cleaner has been offered as an official proposal of mid-Taiwan agent of TOYOTA. The success of this product is continuing to grow on a daily basis. EverDependUp is very excited about the unlimited potential of this product.

In 2007, we have successfully development of :

• Marking Eraser, to clean thermal curing Ink on aluminum mechanical parts.
• TRM Glue Cleaner, to clean thermal resist masking tape Glue.
• Chip Magazine Cleaner
• PowerWash condenser/radiator cleaner has been offered as major service of NISSAN, HYUNDAI, MITSUBISHI Taiwan.

In 2008, we have successfully development of :

• Cleansing solution for gel particle in ITO etching tank and pipe ,
• Cleansing solution for ITO vapor on ITO glass,
• Polyimide Cleaner,
• Ceramic GDP injector Cleaner,
• Cleansing solution for silicon glue in ITO glass and polarizer,
• Particle cleaner for Pellicle (for photo Mask) manufacture equipment,
• Forging Aluminum Parts Safe Cleaner,
• After curing marking eraser,
• Hard lacquer Cleaner, Recycle Disk Cleaner,
• Silicium Powder Cross-Linking Agent,
• Aluminum Molds hypersonic Cleaner,
• Cleansing solution for Fish net.

In 2009, we have successfully development of :

• Cleansing solution for Plate heat Exchanger,
• Cleansing solution for TDI and HMDI reaction polymer,
• Silica Membrane Cleaner,
• Silicon Nitride(Si3N4)Cleaner pH 7.0 on aluminum parts,
• Evaporator cleanser,
• Cleansing solution for water marks on large aluminum mechanical parts after wet sand blasting treatment,
• The cleansing solution for marks on MicroSD cards,
• The silicon glue cleansing solution on Fresnel Lens,
• aluminum alloy and stainless steel weld cleansing solution.
• Nuclear power station heat transfer tube cleansing solution.
• Touch lens frame-ink cleansing solution.
• PU thermal curing ink on golf ball cleansing solution.

In 2010, Our company has achieved Bureau Veritas ISO9001: 2000 certification.
And we have successfully development of :

• Recycle Diffusion Sheet of backlight module cleansing solution.
• Heavy Duty Hands Cleaner with WALNUT SHELL.
• Radiator and condenser Activator pH 5.0.
• Wafer Testing probe cleansing solution.
• Hot steel mold cleaner HMC03 for low foam and environmental protection purpose.
• Screen cleaner.
• Aluminum Molds hypersonic Cleaner AMH02.
• ABS resin decompose solution.
• Thermoplastic Rubber (TPR) decompose solution.
• High foam alkaline tolerate Surfactant.
• Synthetically Glue Cleaner SynGC04-for clean optic glue on multi coating ITO glass.
• Building exterior cleaner BEC01.
• Neutral Particle Cleaner PTC11.
• Rubber separator RSS01.
• After Curing Hard Marking Eraser ACHM01.

In 2011, we have been rewarded by (Industrial Development Bureau, Ministry of Economic Affairs) CITD with R&D subsidies two consecutive times. Moreover, R & D projects executed awarded CITD adjudicators recommended to the National Science Council for the excellent R & D case.
And we have successfully development of :

• Aluminum neutral aqueous paint stripping agent AHLR03
• Screw special degreasing agent SDA03
• Optical sheet of plastic (OCA) stripping and Optical liquid glue (OCR) stripping cleaner
• PI dry etching process aluminum parts clean.
• GaN quartz parts clean.
• Solder paste flux cleansing solution.
• RDC01 International Safe Transit concentrated formula development projects.
• Chemical hardness Glass residual potassium nitrate clean projects.
• ITO / molybdenum, aluminum, molybdenum sensor glass cleansing solution.
• Free phosphorus formulation development projects for Silicon Nitride detergent.
• Anisotropic Conductive Film Eraser, ACF clean gel ACHM04-AG.
• Drop-resistant screw stripping cleaner.
• Teflon braided belt cleaning solution.

In 2012, we have successfully development of :

• Water residual marks on chemically strengthened glass clean case.
• SGC04 applied to the hardening ink strip of Cover Glass.
• Potassium residual marks on chemically strengthened glass clean case.
• SGC04 applied to remove anti-dazzle coating of CG .
• Synthesis glue remover SynGC08.
• Synthesis glue remover SynGC09, and successfully used to remove 3M 8146 adhesive residue.
• SMC01 used to remove scorch in stainless steel after laser cutting.
• ABA01 applied to reductive bleaching zinc aluminum alloy.
• SMC04 applied to to remove burn marks weld aluminum.
• SMC01 used in stainless steel to clean rust marks.
• RDC01 applied to clean resin tanks / LOCA recycle  plastic bucket.
• SMC03 used to remove scorch in aluminum parts.
• CuP01 applied to the case of chemical polishing of copper rod.
• SynGC11 synthetic glue cleaner is applied to clean silicon rubber.
• SMC04 applied to clean GaN on quartz parts.
• SGC04 used in stainless steel needles to clean silicone glue.

In 2013, we proposed to apply entered Central Taiwan Science Park. The same year the National Science Council Committee reviewed and accepted EVER DEPENDUP CO., LTD. into the science park.
And we have successfully development of :

• SynGC05 synthetic glue remover applied to clean asphalt glue on concave glass.
• SynGC14 synthetic glue remover applied to clean liquid OCA after thermosetting on cover glass of touch panel.
• SynGC15 synthetic glue remover applied to clean liquid OCA after thermosetting on Sensor glass of touch panel.
• PTC04 applied to clean fog white spots on chemically strengthened glass caused by spit potassium.
• PTC04 applied to clean potassium nitrate residue on glass.
• SynGC11 and SynGC11G to clean optical liquid adhesive.
• ACHM06 hardening ink cleaner applied to remove hardened PU paint of golf ball.
• ITO, IGZO, Ag, Mo plating etchant.
• SGC04 is applied to remove drop-resistant rubber in the screws.
• AHLR03 and AHLR05 applies tank engine clean.
• AHLR03 applies ESC Parts (TEL8500 VIA ETCH) clean.
• SGC04 applied to clean vinyl adhesive residue after wafer sealing.
• PTC13 particle cleaner applied to clean borosilicate glass.
• HMC06A and SMC04 used in rubber mold cleaning.

In 2014, our company obtained the licenses of air, water, waste pollution control permit, becoming the only manufacturer in the Central Taiwan Science Park with registered cosmetics and professional process cleaning agent manufacturing industry. And we have successfully development of :

• ACHM04-A epoxy glue detergent is applied to clean after curing epoxy resin (after mix with hardener).
• ACHM04-G hardening ink cleaner applied to remove the GT-7 Ink hardening coating on glass.
• COR01 Copper oxide reductant is applied to reducing polishing on oxide copper alloy after heat treatment.
• PTC17 applied to integrated circuit fabrication to remove PI, resin particle and lens cleaning.
• PTC06i particle cleaner applied to clean lens(S-BSM14) after Centering grinding.
• ACHM04-AG neutral hardening ink strip gel, used to clean ACF on FTP Driver.
• Simple water hardness titration test kits.
• AHLR03-AL used in aluminum / magnesium / steel polishing wax cleaning. No fluorine, chlorine, bromine, iodine, and halogen elements, Low-toxic, Excellent effect of clean polishing wax, Can completely replace a toxic compound such as methylene chloride, trichlorethylene,  bromopropane and other EPD Regulated chemicals.
• ACHM01-GG acidic hardening ink strip gel , used in Enameled wire fast peeling paint.
• AHLR03-GU used in automated washing line to clean peel-able adhesive (protective film) adhesive residue on OGS and particle.
• AHLR03-DG applied to sensitive easily discolored aluminum-magnesium alloy processing oil cleaning.
• PTC18 applies TiO2 / SiO2 40 metal plating layer stripping.

In 2015, we developed the hardened ink cleaning agent ACHM04-H1, which was successfully used to remove PI (polyimide) heated to 400°C and strip photoresist. The neutral ACHM04-H1 can complete the work without damaging the aluminum structure of the wafer.

• PTC13 was applied to EMC (Epoxy molding compound) overflow removal.
• ACHM01-G hardening ink cleaning agent was used to remove PEEK plastic tubes from ceramic parts and remove epoxy glue.
• PTC21 was used to clean the particle coating of GT7-2 lenses.
• Development of ITO IGZO Ag Mo coating etching solution.
• ACHM04-H2 was used to remove hardened transfer stickers without damaging the carbon fiber workpiece.
• PTC13 was successfully applied to the cleaning of molybdenum sheets of RF (Radio Frequency) heat dissipation components.
• PTC13 was applied to the wafer probe passivation layer cleaning case.
• ACHM01-K hardening ink cleaner is used to remove the hardening paint covering the fingerprint reader chip without damaging the green paint on the PCB board.
• PTC18 dust cleaning agent was used to remove SiO2 coating on quartz rings.
• PTC13 dust cleaning agent was used to remove vacuum sputtered aluminum metal coatings from PC shields.
• PTC13 was used to remove the black matte hardening ink on the surface of the tank prism.
• ACHM04-A hardening ink cleaning agent was used to remove the hardening ink after spray printing and curing on MicroSD molds.
• PIC06-G was applied to the ACF removal of anisotropic conductive adhesive.
• ACHM01-GG hardening ink removal gel was used to remove PVF fluorinated polyethylene insulation layer from copper strips.
• PTC17plus dust cleaning agent was used to clean the carbon powder attached to the surface of IC chips after laser cutting.

In 2016, the amino-based surfactant IFA02 was developed. It has extremely long foam durability and was successfully used in the Agricultural Science and Technology Research Institute to cover chicken houses with nitrogen foam to kill chickens with avian influenza. It is extremely low irritant and can make chickens fall asleep peacefully without causing any irritation to the eyes. This surfactant has also been successfully used in stage foam and snowmaking machines.

• PTC07b was used to clean the white mist caused by potassium nitrate drug residue on chemically strengthened glass.
• SynGC19 synthetic adhesive remover was used to remove OCA adhesive from TP-LCM samples.
• Development of ACHM04-H1 was completed and applied to the photoresist stripping of GaAs wafer (with plasma-baked AZ4620 on it).
• Development of MC13 refrigerator mildew remover
• Development of PTC17plus dust cleaning agent was completed and applied to the cleaning of image sensor micro lenses with tens of millions of pixels.
• Development of ACHM04-H1 hardening ink remover was completed for use in the stripping of epoxy resin hardening ink (EPOXY) from optical fiber probes (SUS630).
• Development of ACHM04-A hardening ink cleaning agent was completed and applied to the removal of hardening ink on the surface of metal wafers.
• ACHM04-H2 hardening ink cleaning agent was used to remove wafer adhesive.
• ACHM04-A3 hardening ink remover was used in the removal of epoxy overflow from LED silver-plated metal lead frames.
• Silicone cleaning agent SGC07A was used to remove graphite residues from polycrystalline silicon columns.
• Development of ACHM04-H1 hardening ink remover was completed for the removal of hardening ink on aluminum alloy anodic film.

In 2017,hardened ink cleaning agent ACHM04-A was successfully used in the removal of epoxy clear coating and epoxy AB glue for aluminum alloy shells. And remove the two-component AB glue on the bonding strength test piece. ACHM04-A hardened ink cleaning agent is a neutral formula, which can be used to remove hardened resin and ink from soft metals such as aluminum, magnesium, zinc, ITO, etc.

• Development of PTC17plus was completed, which was used to clean ceramic parts in plasma cleaners.
• CuP01 copper oxide wiper.
• PTC09 dust cleaning agent was applied to the cleaning of S-BSM14 lens after centering and grinding.
• ACHM04-H1 hardening ink remover is used to remove the new type of screw Anti-loosening glue.
• ACHM04-H1 hardening ink remover is used to remove epoxy resin hardening ink (EPOXY) from optical fiber probes.
•  PTC13 was used to remove water marks and anti-glare films on strengthened glass.
• HMC03 was applied to the cleaning of heat medium heating tubes at Taipower Nuclear Power Plant No. 3.
• Development of AHLR03 and AHLR03-D was completed and applied to the cleaning of tar and coke attached to tank engines.
• PTC18 particle cleaner was used to remove the SiO2 vapor deposition coating of SUS360 stainless steel.
• SynGC04 synthetic adhesive remover was used to remove double-sided tape and residual adhesive.
• Development of PTC13 particle cleaner was completed and applied to the removal of silicone from stainless steel needles.
• PTC13 particle cleaner was applied to the new type of anti-fall glue stripping of screws.
• SynGC25 synthetic adhesive remover was applied to PET panels (printing ink on PET boards, and affixing PET masks with 3M double-sided tape and then aluminum-plating) to remove particles and residual adhesive.
• ACHM04-H2 HG hardening ink remover is used for zinc alloy hardening ink stripping.
• SMC04 silicon dioxide film cleaner was used with a vibration grinder to remove surface release agent residues and silicon grains from JIS A356 aluminum alloy.
• PTC17plus was used to clean particles and residual adhesive from OGS peelable adhesive.
• PTC17plus was used to clean lenses after coating and remove out gasing particles caused by matte ink in oven.
• SMC04 was used to remove GaN coatings from quartz parts.
• Development of COR01 copper oxide reducing agent and COP01 copper protective agent was completed and applied to the removal of oxidation marks and re-oxidation prevention of oxygen-free copper blocks.
• SMC04 and A2yD were used in laser cutting of stainless steel to remove scorch marks.

In 2018, AHLR03-D was developed and applied to the separation of PVF-PET-PVF on solar back panels. The back sheet of solar panels need to be protected from short circuits caused by moisture intrusion, and oxidation caused by air intrusion when exposed to wind, sun and rain outdoors. It needs to have excellent weather resistance and stability. The problem is that once the solar panels are scrapped, this composite backsheet (PVF-PET-PVF) cannot be decomposed when buried, and combustion produces hydrofluoric acid that corrodes the incinerator...becoming extremely difficult to handle waste. AHLR03-D can successfully separate the solar backsheet (PVF-PET-PVF) into its pure materials of PVF and PET.

• AHLR03-GU aluminum alloy water-based paint stripper is used to clean and remove residual adhesive from poorly cured UV adhesive.
• ACHM04-Aplus hardened ink cleaning agent was applied to the new anti-fall glue removal case.
• NGC02 natural adhesive remover and SynGC18 synthetic adhesive remover were used to remove residual adhesive from mobile phone cases.
• ACHM04-A plus hardening ink cleaner is used to remove EPOXY ink from stainless steel molds.
• ACHM04-A plus4 hardening ink cleaning agent was applied to PU adhesive stripping.
• AHLR03-Dplus3 stripper is used for powder coating stripping of stainless steel and copper parts.
• ATA01 hydrogenated amine alkyl long carbon chain surfactant was used for rosin flux removal (De-flux).
• SPS01 stainless steel wipe is used to wipe and remove fingerprints and oil stains on stainless steel plates.
• AHLR03-DF aluminum alloy water-based paint stripper was used for rosin flux removal (De-flux).
• RSS01 rubber metal separator is used to remove large areas of rubber from metal parts.
• GM01-1 hot steel mold cleaning agent was used for rubber mold cleaning.
• AHLR03-GU aluminum alloy water-based paint stripper is used to remove residual adhesive from optical lens protective films.
• SynGC04 synthetic adhesive remover was used to clean the residual adhesive on optical lens protective films.
• PTC13 particle cleaner was used to remove PI residues from glass.
• ACHM04-A plus hardening ink cleaning agent was used to remove EMC residues from molds.

In 2019, we developed the gel-type hardened ink cleaning agents ACHM04-AG and ACHM04-HG. The gel type does not flow and can be used for local application and coating on vertical surfaces to remove hardened ink. For example, it is used to remove anisotropic conductive adhesive ACF.

• PTC17plus dust cleaning agent was used for solder paste cleaning.
• AHLR03-GU aluminum alloy water-based paint stripper and PTC09-B particle cleaner were applied to OGS strippable adhesive cleaning case.
• PTC06i particle cleaner was used to remove oxidation rust spots on gold-plated nail racks.
• PTC06i particle cleaner was used in the cleaning case of the centering grinding S-BSM14 lens.
• ACHM04-H1 hardened ink remover is used to remove the new type of screw anti-fall glue (ACHM04-E cannot be removed).
• SGC04 was applied to the sample of chemically strengthened glass with anti-glare film on one side to remove water marks and anti-glare film.
• Development of SGC04 was completed and applied to the removal of silicone from glass panels.
• Stripper AHLR03-GM uses ultrasonic equipment to remove residual rubber and release agent on the mold.
• Development of LCP12-1 laser cutting protective agent was completed for use in wafer laser cutting protection.
• Selective stainless steel etchant HSLE01 was used to remove the stainless steel oxide layer and slag after laser drilling of 316 stainless steel needles.
• C3b strong degreasing agent was used to remove tar and carbon deposits from stainless steel nozzles of heavy oil boilers.
• AHLR03-D2 was used to remove liquid coatings on aluminum bottles.
• AHLR03-D2 is used for wax removal on the surface of ceramic (Sapphire alumina) aluminum-plated wafers.
• C3b strong degreaser and ferrous steel oxide cleaner SOR04 were used to remove tar and coke from stainless steel head screws.
• AHLR03-D2plus was used to remove residual glue on the surface of the die after dicing.
• ACHM04-HG gel-type ACF Clean Gel for removing ACF.
• Quartz glass etching agent.

In 2020, SCE01 selective copper etchant was developed and applied to the removal of copper and titanium deposits on aluminum Parts. Aluminum alloy are afraid of acids and alkalis. Both acids and alkalis will etch aluminum  Parts. The copper and titanium coatings need to be etched off the soft metal aluminum alloy. It is undoubtedly a very difficult challenge. Our company has successfully completed the development of SCE01 selective copper etchant. It can corrode copper and titanium coatings while keeping aluminum alloy intact.

• Development of PTC13 dust cleaning agent was completed and applied to the cleaning of filling machine parts.
• PTC13 dust cleaning agent was applied to the cleaning case of removing graphite residue from polycrystalline silicon columns.
• PTC13 was used to remove residual epoxy and release agent from LED packaging molds.
• AHLR03-D2plus and ACHM04-L were applied to the removal of water-washable adhesive residues.
• SMC04 silicon dioxide film cleaner (pH 5.0) was used to remove residual silicon scale from stainless steel nozzles.
• PTC13 dust cleaning agent was used in PI photoresist condensation box to remove PI residue cleaning case.
• ACHM04-A plus hardening ink cleaning agent for use in OLED Driver chip removal and ACF residual glue removal in gold bump gap.
• PTC13 dust cleaning agent was used to remove hardened ink from optical lenses.
• The development of the photo mask molybdenum oxide layer pattern removal project was completed.
• STR01 selective titanium cleaning agent was used in the sputtering equipment Collimator collimator deposition titanium removal case.
• Development of SCE01 selective copper etchant was completed for the removal of PVD stopper coatings.
• PTC53B particle cleaner was used in soft optical lens cleaning.
• ACHM04-H1 was applied to 3D Stacked Die wafer separation.
• AHLR03 was applied to the cleaning case of ESC Parts (TEL8500 VIA ETCH).

In 2021, we developed AHLR03-GTC aluminum stripper for use in removing graphite paste from aluminum wheels. During the forging process of aluminum alloy wheels, a very thick layer of graphite paste is applied on them to allow the aluminum block to slide and form in the mold. This makes it difficult to completely whiten the formed aluminum alloy wheels by pickling or alkali washing. This results in the need for a large amount of CNC and manual grinding to remove the black epidermis after forging. The newly developed AHLR03-GTC aluminum stripper can effectively and simply soak for 3 minutes, and you will get a shiny aluminum alloy wheel rim after taking it out. Greatly reduce subsequent processing time. Since the surface is less etched, there will be no crystallization Pattern (over-etching will cause the Pattern formed by aluminum crystals to be clearly seen on the surface of the aluminum part).

• AHLR03-D2plus and ACHM04-L were applied to rubber-metal separation.
• SGC04 silicone cleaning agent was used to remove hardened ink from OGS samples.
• PTC-3b dust cleaner was used to remove Blue Tape peelable adhesive residue from stainless steel parts.
• ACHM04-L hardening ink remover is used to remove the new polyester and epoxy resin anti-fall glue of screws.
• ACHM04-L hardening ink remover is used to remove the quick-drying adhesive residue of rubber adhesive on PEEK Parts.
• PTC-3b dust cleaner was used to remove particle residual glue from stainless steel wafer frames.
• AHLR03-D2Plus6 hardening ink cleaning agent was used in the removal of hardened paint on golf club heads.
• AHLR03-FGTC aluminum alloy special water-based paint stripper (pH7.0) was used to remove forged graphite from 6061 aluminum parts.
• Development of CSC01 ceramic substrate cleaner was completed and applied to quartz parts cleaning case.
• SMC04 stainless steel oxide cleaner (pH 5.0) was used to remove residual silicon scale from stainless steel nozzles.
• Development of SynGC21 synthetic adhesive remover was completed and applied to the bonding wire spool adhesive removal and cleaning case.
• SGC04 silicone cleaner was used in silicone sealant removal test and hardened ink cleaner ACHM04-Aplus was used in EPOXY sealant removal case.
• ACHM04-H1 hardening ink remover was applied to electronic paper ink removal case.
• PTC17plus dust cleaning agent was used to clean the carbon powder attached to the surface of the copper probe after laser cutting of the copper sheet.

In 2022, we developed PTC-HMC06 particle cleaner, which was used to remove residual epoxy and release agent from LED packaging molds. The epoxy molding compound left on the LED package mold is usually removed by adhesive. However, after repeated removal, some residues will eventually remain. As the number of times increases, the originally mirror-like mold will gradually become blurred due to trace residues. At this time, the mold can only be disassembled and sent back to the mold factory for re-arrangement. In addition to spending money, you also have to wait for the mold to be returned before you can put it back online. PTC-HMC06 dust cleaner can clean the disassembled mold with ultrasonic machine to restore the mirror effect of the mold. Complete cleaning in less than 10 minutes and you can go back online and continue working.

• PTC17plus was applied to the cleaning of biochips and carrier PMMA transparent visible areas.
• Development of PTC13 dust cleaning agent was completed and applied to the removal of silicone from glass panels.
• C11 strong degreasing agent was used to remove tar and carbon deposits from stainless steel nozzles of heavy oil boilers.
• C11plus was used to remove tar and coke from barbecue grills.
• Development of ACHM04-H1 hardening ink remover was completed and applied to wafer PBO PI removal.
• FGTC04 was applied to the cleaning of GaN quartz parts.
• AHLR03-D3plus aluminum alloy water-based paint stripper was used to remove micron gap flux cleaning from 2.5D packaged chips.
• ACHM04-H1 hardening ink remover was used to remove primer on aluminum alloy.
• Development of ACHM01-SG hardening ink cleaning agent was completed and applied to the removal of residual glue on ceramic substrates.
• Development of SGC04 was completed and applied to the removal of silicone from copper rings.

In 2023, we developed the hardening ink cleaning agent ACHM04-Aplus and applied it to remove EPOXY ink from stainless steel molds. This mold is repeatedly sprayed and baked with EPOXY ink. When removing residual ink, general hardening ink cleaners will become completely ineffective after being used 3 to 5 times. Hardening ink cleaning agent ACHM04-Aplus can be used repeatedly up to 20~30 times.

• A project to use environmentally friendly, low-toxic hydrocarbon solvents: ECA clean21, to replace dichloromethane for cleaning tin sheets.
• BEC01 building exterior wall cleaning agent.
• AHLR03-AL aluminum alloy water-based paint stripper was used for cleaning the polished soil on the aluminum alloy surface.
• Development of ACHM04-L hardened ink remover was completed for use in a project to remove residual resin (epoxy resin) from the nozzle of an EMC dispensing valve head.
• AHLR03-D2 aluminum alloy water-based paint stripper was used to clean carbon deposits in diesel tank engines.
• PTC18 dust cleaning agent PTC18 was used to remove tantalum oxide (Ta2O5) coating from quartz glass.
• SMC04 metal oxide cleaner was used to remove oxides from the residual scale of the electrolytic cell roller.

In 2024, we developed ACHM04-A and AHLR03-D2plus hardening ink removers for use in the removal of photoresist from die chips for packaging and testing. Generally, strong acid, strong alkali or toxic halogen solvent is required to decompose EMC (epoxy molding compound) or structural material photoresist remaining on the wafer. Moreover, after decomposition, excessive corrosion often makes it impossible to effectively determine the cause of the chip short circuit or breakpoint. ACHM04-A and AHLR03-D2plus hardened ink removers are neutral, halogen-free, environmentally friendly agents that can effectively decompose organic polymers and are low in toxicity and corrosion.

• PTC-3B particle cleaner was used to remove EPOXY residue from the electrolytic cell roller.
• Development of PTC13  particle cleaner was completed and applied to the removal of photoresist in glass wafer (copper process).
• Development of PTC13 dust cleaner was completed and applied to aluminum wafer spin cleaning to increase cleanliness and photoresist adhesion strength.
• SMC03 metal oxide cleaner was used to remove water marks on aluminum alloy surfaces.
• Development of ACHM04-A hardening ink remover was completed and applied to the removal of matte ink on glass lenses.
• PTC17plus was applied to optical glass cleaning.
• Development of ACHM04-H1 hardening ink cleaning agent was completed and applied to the removal of ink from wireless RF component packaging.
• AHLR03-D2plus hardening ink remover was used to remove wafer resin structure.
• ACHM04-Aplus hardening ink remover applied to the removal of organic residues in plasma cleaner parts.
• SynGC21 synthetic adhesive remover applied to the particle removal of PC and acrylic lenses.
• K1D copper polishing agent was used in the removal of oxides from copper electrodes in electrolytic cells.